Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference14 articles.
1. Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding
2. Thermal fracture toughness measurement for underfill during temperature change
3. Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application
4. Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading
5. Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device
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4. High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging;Composites Part A: Applied Science and Manufacturing;2019-03
5. Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods;Microelectronics Reliability;2012-09
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