Realizing ultra-thin high reliability storage devices with large capacity by package and PCB collaborative design
Author:
Affiliation:
1. Huawei Technologies Co., Ltd,Xian City,P.R.China,710077
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457757.pdf?arnumber=10457757
Reference16 articles.
1. 3-D Embedded Packaging Technology: Analyzing its needs and challenges
2. Ultra-thin actives for embedded components: halfway between thin film technology and embedded Surface Mounted Device.
3. Thermo-mechanical simulation of PCB with embedded components
4. Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board
5. Drop performance evaluation for application of different underfill processes
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