Thermo-mechanical simulation of PCB with embedded components-Reference-Cited by-同舟云学术

Thermo-mechanical simulation of PCB with embedded components

Published:2016-10 Issue: Volume:65 Page:108-130
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kpobie W.,Martiny M.,Mercier S.,Lechleiter F.,Bodin L.,Lecavelier des Etangs-Levallois A.,Brizoux M.

Funder

Direction Générale de la Compétitivité, de l'Industrie et des Services

Board on Board Technology

Région Lorraine

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Highly reliable processes for embedding discrete passive components into organic substrates;Cho;Microelectron. Reliab.,2008

2. Embedded components in printed circuit boards: a processing technology review;Jillek;Int. J. Adv. Manuf. Technol.,2005

3. Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board;Maia Filho,2010

4. Board level drop test and simulation of leaded and lead-free BGA-PCB assembly;Qu;Microelectron. Reliab.,2007

5. Random vibration reliability of BGA lead-free solder joint;Liu;Microelectron. Reliab.,2014

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