Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board-Reference-Cited by-同舟云学术

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Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board

Published:2010-04 Issue: Volume: Page:
ISSN:
Container-title:2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Maia Filho W C,Brizoux M,Grivon A

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5457934/5464502/05464607.pdf?arnumber=5464607

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Realizing ultra-thin high reliability storage devices with large capacity by package and PCB collaborative design;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Investigation of the effect and optimization of material properties on the printed circuit board;Composites and Advanced Materials;2023-11-02

3. Embedded Optoelectronics in Fiberglass PCBs and Applications for Robotics with Human Interface and ML-Enabled Detection;2023 IEEE International Conference on Systems, Man, and Cybernetics (SMC);2023-10-01

4. Investigations on the Robustness of a Solderless Assembled Electronic Module;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

5. Towards mass production of Air Filled Substrate Integrated Waveguides (AFSIW) for ultra-low loss, broadband radar applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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