Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device-Reference-Cited by-同舟云学术

Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device

Published:2006-05 Issue:5-6 Volume:46 Page:923-929
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Morita Yasuyuki,Arakawa Kazuo,Todo Mitsugu,Kaneto Masayuki

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Mechanical analysis of electronic packaging system;McKeown,1999

2. A fracture mechanics analysis of the effects of material properties and geometries of components on various types of package cracks;Lee;IEEE Trans Comp Pack Manuf Tech, Part A,1996

3. Study of delaminated plastic packages by high temperature Moiré and finite element method;Liu;IEEE Trans Comp Pack Manuf Tech, Part A,1997

4. Ham SJ, Lee SB. Measurement of creep and relaxation behaviors of CSP using Moiré interferoemtry. In: Proc of the SEM IX int cong on exp mech, 2000. p. 738.

5. Recent advancements of Moiré and microscope Moiré interferometry for thermal deformation analyses of microelectronics devices;Han;Exper Mech,1998

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel maleic anhydride derivatives: liquid crystalline materials with enhanced mesomorphic and optical characteristics;Frontiers in Chemistry;2023-11-09

2. Effects of Encapsulant Properties on the Thermo-Mechanical Reliability of Double-Side Cooled Power Modules for Traction Inverters;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

3. Residual Thermal Strain Distribution Measurement of Underfills in Flip Chip Electronic Packages by an Inverse Approach Based on the Sampling Moiré Method;Experimental Mechanics;2020-01-15

4. Rapid SoC prototyping utilizing quilt packaging technology for modular functional IC partitioning;Proceedings of the 27th International Symposium on Rapid System Prototyping: Shortening the Path from Specification to Prototype;2016-10

5. Thermomechanical Fatigue Performance of Lead-Free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills;Japanese Journal of Applied Physics;2012-05-21