Evaluation of thermal fatigue crack propagation in underfill resin materials for electronic packages-Reference-Cited by-同舟云学术

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Evaluation of thermal fatigue crack propagation in underfill resin materials for electronic packages

Published:2022-02-03 Issue:5 Volume:45 Page:1349-1360
ISSN:8756-758X
Container-title:Fatigue & Fracture of Engineering Materials & Structures
language:en
Short-container-title:Fatigue Fract Eng Mat Struct

Author:

Watanabe Yusuke¹,Yamaguchi Hiroshi²,Enomoto Toshiaki²,Ogawa Kensuke³,Kobayashi Takaya³,Omiya Masaki⁴^ORCID

Affiliation:

1. School of Integrated Design Engineering, Faculty of Science and Technology Keio University Tokyo Japan

2. Technical R&D Division NAMICS Corporation Niigata Japan

3. Structural Analysis Division Mechanical Design & Analysis Corporation Tokyo Japan

4. Department of Mechanical Engineering Keio University Tokyo Japan

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1111/ffe.13664

Reference25 articles.

1. Flip-Chip Underfill: Materials, Process, and Reliability

2. Influence of underfill materials on the reliability of coreless flip chip package

3. The impact of underfill properties on the thermomechanical reliability of FCOB assembly

4. Bonding Characteristics of Underfilled Ball Grid Array Packaging

5. Improvement of Board Level Reliability for μBGA Solder Joints Using Underfill

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Damage mechanisms of spline teeth of friction plates under non-uniform impact;Engineering Fracture Mechanics;2024-02

2. Temperature Cycle Reliability Analysis of an FBAR Filter-Bonded Ceramic Package;Micromachines;2023-11-20

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