Improvement of Board Level Reliability for μBGA Solder Joints Using Underfill-Reference-Cited by-同舟云学术

Improvement of Board Level Reliability for μBGA Solder Joints Using Underfill

Published:2003 Issue:10 Volume:44 Page:2175-2179
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Kim Jong-Min¹,Farson Dave F.²,Shin Young-Eui³

Affiliation:

1. Department of Manufacturing Science, Graduate School of Engineering, Osaka University

2. Department of Industrial, Welding and Systems Engineering, The Ohio State University

3. Deptartment of Mechanical Engineering, Chung-Ang University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/44/10/44_10_2175/_pdf

Reference24 articles.

1. 1) R. R. Tummala, E. J. Rymaszewski and A. G. Klopfenstein: Microelectronics Packaging Handbook-Technology Drivers Part I, (Chapman & Hall, 1997) 3–128.

2. 2) J. H. Lau and Y. H. Pao: Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, (McGraw-Hill Companies, Inc., 1997) 1–397.

3. 3) I. Anjoh, A. Nishimura and S. Eguchi: IEEE Trans. Electron Devices 45 (1998) 743–752.

4. 4) Z. P. Wang, Y. M. Tan and K. M. Chua: Microelectronics Reliability 39 (1999) 1351–1356.

5. 5) S. C. Hung, P. J. Zheng, S. H. Ho, S. C. Lee, H. N. Chen and J. D. Wu: Microelectronics Reliability 41 (2001) 677–687.

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