Selection of Proper Fatigue Model for Flip Chip Package Reliability-Reference-Cited by-同舟云学术

Selection of Proper Fatigue Model for Flip Chip Package Reliability

Published:2005-12 Issue: Volume:502 Page:393-398
ISSN:1662-9752
Container-title:Materials Science Forum
language:
Short-container-title:MSF

Author:

Shin Young Eui¹,Kim Yeon Sung¹,Kim Hyoung-Il,Kim Jong Min²,Chang Kyong Ho¹,Farson Dave F.

Affiliation:

1. Chung-Ang University

2. Osaka University

Abstract

There have been diverse fatigue models and approaches to properly estimate solder joint reliability. However, it is one of the most difficult problems to determine which solder constitutive models and fatigue models can be applied best. In this paper, both viscoplastic and elastic-plastic-creep solder constitutive models could be utilized to calculate accumulated inelastic response under 208 K to 423 K(-65 °C to 150 °C) thermal cycling condition. And two different fatigue models, Darveaux and creep-fatigue model were applied to find solder joints fatigue life for flip chip assembly. Moreover, each fatigue life was compared to experimental result for the validation of finite element analysis. The actual number of cycles to failure was obtained from cross sectional view of the package with SEM.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.scientific.net/MSF.502.393.pdf

Reference16 articles.

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2. J. H. Lau and Y. H. Pao: Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies, (McGraw-Hill Companies, New York 1997).

3. L. Anand: ASME, J. Mater. Technol. Vol. 104 (1982), p.12.

4. R. Darveaux: 50th ECTC (2000), p.1048.

5. Y. Liu, S. Irving, M. Tumulak and E. A. Cabahug: 52th ECTC (2002), p.604.

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