Influence of underfill materials on the reliability of coreless flip chip package

Author:

Chuang Chun-Chih,Yang Tsung-Fu,Juang Jin-Ye,Hung Yin-Po,Zhan Chau-Jie,Lin Yu-Min,Lin Ching-Tsung,Chang Pei-Chen,Chang Tao-Chih

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. A test method for assessing of solder joint reliability of FCBGA package;Wang;Microelect Reliab,2004

2. High-performance flip chip package with copper pillar bumping;Kloeser;Global SMT Package,2006

3. Flip chip interconnection systems using copper wire stud bump and lead-free solder;Zama;IEEE Trans Elect Packag Manuf,2001

4. Howard C, Nair S, Ang S, Schaper L. An investigation of conductive polymer flip chip attachment in multichip module applications. In: Elect Comp Technol Conf; May 21–24, 1995. p. 1244–9.

5. Chang D, Wang YP, Hsiao CS. High performance coreless flip chip BGA packaging technology. In: Proc Elect Comp Technol Conf; May 29–June 1, 2007. p. 1765–8.

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