Physical and Barrier Properties of Plasma-Enhanced Chemical Vapor Deposited α-SiC:H Films from Trimethylsilane and Tetramethylsilane-Reference-Cited by-同舟云学术

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Physical and Barrier Properties of Plasma-Enhanced Chemical Vapor Deposited α-SiC:H Films from Trimethylsilane and Tetramethylsilane

Published:2003-07-15 Issue:Part 1, No. 7A Volume:42 Page:4273-4277
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:en
Short-container-title:Jpn. J. Appl. Phys.

Author:

Chiang Chiu-Chih,Chen Mao-Chieh,Ko Chung-Chi,Wu Zhen-Cheng,Jang Syun-Ming,Liang Mong-Song

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

http://stacks.iop.org/1347-4065/42/i=7R/a=4273/pdf

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