EUV Resists: Pushing to the Extreme-Reference-Cited by-同舟云学术

EUV Resists: Pushing to the Extreme

Published:2014 Issue:6 Volume:27 Page:725-730
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Naulleau Patrick¹,Anderson Christopher¹,Chao Weilun¹,Bhattarai Suchit²,Neureuther Andrew²,Cummings Kevin³,Jen Shi-Hui³,Neisser Mark³,Thomas Bryan³

Affiliation:

1. Center for X-ray Optics, Lawrence Berkeley National Laboratory

2. EECS, University of California

3. SEMATECH

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

https://www.jstage.jst.go.jp/article/photopolymer/27/6/27_725/_pdf

Reference12 articles.

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2. 2. Y. Tanaka, K. Matsunaga, S. Magoshi, S. Shirai, K. Tawarayama, and H. Tanaka, “Resolution capability of SFET with slit and dipole illumination,” Proc. SPIE, 7969 (2011) 79690Q.

3. 3. J. Chun, S. Jen, K. Petrillo, C. Montgomery, D. Ashworth, M. Neisser, T. Saito, L. Huli, D. Hetzer, “SEMATECH’s Cycles of Learning Test for EUV Photoresist and its applications for Process Improvement,” Proc. SPIE, 9048 (2014) 90481Z.

4. 4. K. Cummings, D. Ashworth, M. Bremer, R. Chin, Y. Fan, L. Girard, H. Glatzel, M. Goldstein, E. Gullikson, J. Kennon, B. Kestner, L. Marchetti, P. Naulleau, R. Soufli, J. Bauer, M. Mengel, J. Welker, M. Grupp, E. Sohmen, S. Wurm, “Update on the SEMATECH 0.5 NA extreme-ultraviolet lithography (EUVL) microfield exposure tool (MET)”, Proc. SPIE, 9048 (2014) 90481M.

5. 5. H. Glatzel, D. Ashworth, D. Bajuk, M. Bjork, M. Bremer, R. Chin, M. Cordier, K. Cummings, L. Girard, M. Goldstein, E. Gullikson, R. Hudyma, J. Kennon, R. Kestner, L. Marchetti, K. Nouri, P. Naulleau, R. Soufli, E. Spiller, D. Pierce, “Projection optics for EUVL microfield exposure tools with 0.5 NA”, Proc. SPIE, 9048 (2014) 90481K.

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