SEMATECH's cycles of learning test for EUV photoresist and its applications for process improvement

Author:

Chun Jun Sung1,Jen Shih-Hui1,Petrillo Karen1,Montgomery Cecilia1,Ashworth Dominic1,Neisser Mark1,Saito Takashi2,Huli Lior2,Hetzer David2

Affiliation:

1. SEMATECH Inc. (United States)

2. TEL Technology Ctr., America, LLC (United States)

Publisher

SPIE

Reference18 articles.

1. Jun Sung Chun, Shiu-Hui Jen, Karen Petrillo, Dominic Ashworth, Mark Neisser, Takashi Saito, Lior Huli, Metz Andrew, “Enabling robust EUV lithography for NXE3300 applications : 2013 SEMATECH’s Cycles Of Learning Project Combined with TEL” EUV Symposium, Toyama, Japan October 2013

2. Resist process applications to improve EUV patterning;Petrillo,2013

3. A. M. Goethals, F. Van Roey, K. Hosokawa, R. Hoefnagels, A. Niroomand, Ph. Foubert, “Assessment of EUV Resist Performance f or sub-22nm HP lines and 26nm contacts on NXE3100,” EUVL Symposium, 2012.

4. Kyoungyong Cho, Karen Petrillo, Cecilia Montgomery, Alexander Friz, Yu-Jen Fan, Chandra Sarma, Dominic Ashworth, Mark Neisser, “EUV resists patterning results at SEMATECH,” EUVL Symposium, 2012.

5. H. F. Hoefnagels, S. Wang, C. Verspaget, R. Mass, T. Wallow, D. Civay, A. Fumar-Pici, “EUV resist performance on 22 nm CH and on 22nm L/S,” EUVL Symposium, 2012.

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