Thermal Flow Property for 193nm Photoresist with Low Dispersion Polymer-Reference-Cited by-同舟云学术

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Thermal Flow Property for 193nm Photoresist with Low Dispersion Polymer

Published:2004 Issue:4 Volume:17 Page:541-544
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Lee Tin-Yu,Yu Chao-Ying,Hsui Meei-Yu,Hayashi R.,Hirayama T.,Iwai T.,Komano H.,Shih JC,Owe-Yang DC,Ho Bang-Ching

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

http://www.jstage.jst.go.jp/article/photopolymer/17/4/17_4_541/_pdf

Reference1 articles.

1. 1) Ting-Yu Lee, Chao-Ying Yu, Meei-Yu Hsu, R. Hayashi, T. Iwai, Jian-Hong Chen, Bang-Ching Ho, J. Photopolym. Sci. Technol., 2003, 483, 16(4)

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1. Terpolymerization of Styrenic Photoresist Polymers: Effect of RAFT Polymerization on the Compositional Heterogeneity;Macromolecules;2015-05-22

2. Preparation of well-defined acid-cleavable branched polymers composed of methacrylates and acrylates;Journal of Industrial and Engineering Chemistry;2015-01

3. Well-defined diblock and triblock copolymers for KrF lithography;Journal of Applied Polymer Science;2010-07-13

4. Parallelizable Simulation of Material Effects of Chemical Shrink Process of Nanolithography;Japanese Journal of Applied Physics;2006-10-06

5. Reaction-diffusion mechanisms for the chemical shrink process of nanofabrication;Chemical Physics Letters;2005-10

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