Effect of NH4OH Concentration on Surface Qualities of a Silicon Wafer after Final-Touch Polishing-Reference-Cited by-同舟云学术

Effect of NH4OH Concentration on Surface Qualities of a Silicon Wafer after Final-Touch Polishing

Published:2011 Issue:6 Volume:158 Page:H641
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Hwang Hee-Sub,Park Jin-Hyung,Choi Eun-Suck,Ahn Jin-Woo,Park Jea-Gun

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Investigation on the final polishing slurry and technique of silicon substrate in ULSI

2. The Effect of the physico-chemical properties of cellulosic polymers on the Si wafer polishing process

3. Effect of Hydroxyethyl Cellulose Concentration on Surface Qualities of Silicon Wafer after Touch Polishing Process

4. The International Technology Roadmap for Semiconductors (2009).

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