Effects of Hydroxyethyl Cellulose and Colloidal Silica Abrasive on the Hydrophilicity of Polished Si Wafer Surfaces
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Chemical mechanical polishing: Theory and experiment
2. Investigation on the final polishing slurry and technique of silicon substrate in ULSI
3. Effect of Hydroxyethyl Cellulose Concentration on Surface Qualities of Silicon Wafer after Touch Polishing Process
4. Effect of NH4OH Concentration on Surface Qualities of a Silicon Wafer after Final-Touch Polishing
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