Role of Dispersant Agent on Scratch Reduction during Copper Barrier Chemical Mechanical Planarization
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference30 articles.
1. Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry
2. Electrogenerated chemical polishing of copper
3. Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
4. Investigation of the barrier slurry with better defect performance and facilitating post-CMP cleaning
5. Ultrasonic vibration-assisted scratch-induced characteristics of C-plane sapphire with a spherical indenter
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