Study on the Dispersing Effect and Mechanism of Labsa on SiO2 in an Alkaline Barrier Slurry
Author:
Affiliation:
1. School of Electronics and Information Engineering, Hebei University of Technology,Tianjin,China,300130
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10531806/10531771/10531895.pdf?arnumber=10531895
Reference7 articles.
1. Environment friendly chemical mechanical polishing of copper
2. Effects of Novel Inhibitor on Galvanic Corrosion of Copper and Cobalt and Particle Removal
3. The effect of structural properties of benzo derivative on the inhibition performance for copper corrosion in alkaline medium: Experimental and theoretical investigations
4. Chemical mechanical polishing of silicon wafers using developed uniformly dispersed colloidal silica in slurry
5. Role of Dispersant Agent on Scratch Reduction during Copper Barrier Chemical Mechanical Planarization
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