Chemical mechanical polishing of silicon wafers using developed uniformly dispersed colloidal silica in slurry-Reference-Cited by-同舟云学术

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Chemical mechanical polishing of silicon wafers using developed uniformly dispersed colloidal silica in slurry

Published:2023-03 Issue: Volume:90 Page:196-203
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Xie Wenxiang,Zhang Zhenyu,Wang Li,Cui Xiangxiang,Yu Shiqiang,Su Hongjiu,Wang Shudong

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference36 articles.

1. Single crystal silicon wafer polishing by pretreating pad adsorbing SiO2 grains and abrasive-free slurries;Bu;Mater Sci Semicond Process,2022

2. Material removal mechanism in chemical mechanical polishing theory and modeling;Luo;IEEE Trans Semicond Manuf,2001

3. Silicon: the semiconductor material;Heywang,2004

4. Improved chemical mechanical polishing performance in 4H-SiC substrate by combining novel mixed abrasive slurry and photocatalytic effect;Wang;Appl Surf Sci,2022

5. A novel slurry for chemical mechanical polishing of single crystal diamond;Liao;Appl Surf Sci,2021

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1. Investigating the partial plastic formation mechanism of typical scratches on silicon wafers induced by rogue particles during chemical mechanical polishing;Materials Science in Semiconductor Processing;2024-10

2. Laser wafer dicing process optimization using the Taguchi approach;Journal of Laser Applications;2024-08-01

3. Recent Development of Abrasive Machining Processes Enhanced with Non-Newtonian Fluids;Coatings;2024-06-21

4. Improving monocrystalline silicon surface quality with chemical mechanical polishing using the slurry with the additive of isopropanol;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-06

5. Understanding and mitigating temperature-induced agglomeration in silica-based chemical mechanical planarization (CMP) slurry storage;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-06

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