Understanding and mitigating temperature-induced agglomeration in silica-based chemical mechanical planarization (CMP) slurry storage
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Published:2024-06
Issue:
Volume:691
Page:133802
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ISSN:0927-7757
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Container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
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language:en
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Short-container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
Author:
Othman AliORCID,
Kim Hong Jin,
Trivedi RahulORCID,
Kulasingam Thayalan,
Seo JihoonORCID