Effect of Hydroxyethyl Cellulose Concentration on Surface Qualities of Silicon Wafer after Touch Polishing Process-Reference-Cited by-同舟云学术

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Effect of Hydroxyethyl Cellulose Concentration on Surface Qualities of Silicon Wafer after Touch Polishing Process

Published:2010 Issue:5 Volume:13 Page:H147
ISSN:1099-0062
Container-title:Electrochemical and Solid-State Letters
language:en
Short-container-title:Electrochem. Solid-State Lett.

Author:

Hwang Hee-Sub,Lim Jae-Hyung,Park Jin-Hyung,Choi Eun-Suck,Ahn Jin-Woo,Park Jea-Gun

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Reference16 articles.

1. Investigation on the final polishing slurry and technique of silicon substrate in ULSI

2. The Effect of the physico-chemical properties of cellulosic polymers on the Si wafer polishing process

3. The International Technology Roadmap for Semiconductors (2007).

4. Effects of Process Parameters on Electrochemical Characteristics of Silicon Wafers during Chemical Mechanical Polishing

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1. Effect of Polyoxyethylene-Based Nonionic Surfactants on Chemical–Mechanical Polishing Performance of Monocrystalline Silicon Wafers;Crystals;2024-05-14

2. Effects of Polyvinyl Alcohol on Silicon Chemical Mechanical Polishing;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17

3. Insight on Surface Changes Post Chemical Mechanical Polishing (CMP) of the Silicon Substrate by Adding Polyoxyethylene Ether;ECS Journal of Solid State Science and Technology;2023-11-01

4. Effects of grinding-induced surface topography on the material removal mechanism of silicon chemical mechanical polishing;Applied Surface Science;2023-09

5. High efficiency chemical mechanical polishing for silicon wafers using a developed slurry;Surfaces and Interfaces;2023-06

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