Effects of grinding-induced surface topography on the material removal mechanism of silicon chemical mechanical polishing-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Effects of grinding-induced surface topography on the material removal mechanism of silicon chemical mechanical polishing

Published:2023-09 Issue: Volume:631 Page:157509
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Tao Hongfei,Zeng Qinyang,Liu Yuanhang,Zhao Dewen,Lu Xinchun^ORCID

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference49 articles.

1. Diamond machining of silicon: A review of advances in molecular dynamics simulation;Goel;Int. J. Mach. Tools Manuf.,2015

2. Ultraprecision grinding technologies in silicon semiconductor processing;Ahearne;Proc. Inst. Mech. Eng. B,2004

3. Grinding wheels for manufacturing of silicon wafers: A literature review;Liu;Int. J. Mach. Tools Manuf.,2007

4. Modern trends in crystal growth and new applications of sapphire;Akselrod;J. Cryst. Growth,2012

5. Grinding of silicon wafers: A review from historical perspectives;Pei;Int. J. Mach. Tools Manuf.,2008

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Molecular dynamics simulations in semiconductor material processing: A comprehensive review;Measurement;2024-09

2. The influence of the types of cluster composite abrasives on the performance of fixed abrasive pads in processing quartz glass;Materials Today Communications;2024-06

3. Polishing-induced material attrition in surface-texturing AlN using a nanoscale polishing tool: An atomic-scale understanding;Tribology International;2024-04

4. Compound mechanical and chemical-mechanical polishing processing technique for single-crystal silicon carbide;Precision Engineering;2024-03

5. Development of mesoporous abrasives and its unprecedented polishing performance elucidated by a novel atomic model;Materials Today Sustainability;2024-03

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3