High efficiency chemical mechanical polishing for silicon wafers using a developed slurry
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,General Physics and Astronomy,Condensed Matter Physics,Surfaces and Interfaces,General Chemistry
Reference37 articles.
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5. Novel α-amine-functionalized silica-based dispersions for selectively polishing polysilicon and Si(100) over silicon dioxide, silicon nitride or copper during chemical mechanical polishing;Veera Dandu;Colloids Surf B Biointerfaces,2010
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