1. Optical interferometry for surface measurements of CMP pads
2. K. Kim, S. Moon, and H. Jeong, inChemical Mechanical Polishing in IC Device Manufacturing III, R. L. Opila, C. Reidsema Simpson, K. B. Sundaram, I. Ali, Y. A. Arimoto, and Y. Homma, Editors, PV 99-37, pp. 402-407, The Electrochemical Society Proceedings Series, Pennington, NJ (1999).
3. Optimization of tribological properties of silicon dioxide during the chemical mechanical planarization process
4. The International Technology Roadmap for Semiconductors 2002, Semiconductor Industry Association, San Jose, CA (2002).