Author:
Lin Cheng-Yung,Liao Chuan-Chieh
Reference12 articles.
1. Kwon, T. Y., Cho, B. J., Venkatesh, R. P., & Park, J. G. (2012, October). Correlation of polishing pad property and pad debris on scratch formation during CMP. In ICPT 2012-International Conference on Planarization/CMP Technology (pp. 1–6). VDE.
2. Mean Residence Time and Removal Rate Studies in ILD CMP
3. Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing
4. Design and Evaluation of Pad Grooves for Copper CMP
5. Study on Groove Shape of CMP Polishing Pad: A Review