Integration of Vertical Carbon Nanotube Bundles for Interconnects-Reference-Cited by-同舟云学术

Integration of Vertical Carbon Nanotube Bundles for Interconnects

Published:2010 Issue:10 Volume:157 Page:K211
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Chiodarelli Nicoló,Kellens Kristof,Cott Daire J.,Peys Nick,Arstila Kai,Heyns Marc,De Gendt Stefan,Groeseneken Guido,Vereecken Philippe M.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. International Technology Roadmap for Semiconductors, Interconnect Report (2007).

2. Electron−Phonon Scattering in Metallic Single-Walled Carbon Nanotubes

3. High-Field Quasiballistic Transport in Short Carbon Nanotubes

4. Reliability and current carrying capacity of carbon nanotubes

5. Thermal Conductance of an Individual Single-Wall Carbon Nanotube above Room Temperature

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