Local electrochemical deposition of Ni into vertical vias in Si/SiO2 substrate
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s00542-022-05335-3.pdf
Reference38 articles.
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2. Arumugam PU, Chen H, Siddiqui S, Weinrich JAP, Jejelowo A, Li J, Meyyappan M (2009) Wafer-scale fabrication of patterned carbon nanofiber nanoelectrode arrays: a route for development of multiplexed, ultrasensitive disposable biosensors. Biosens Bioelectron 24(9):2818–2824. https://doi.org/10.1016/j.bios.2009.02.009
3. Bajpai VK, Pant P, Solanki CS (2017) Thin uniform nickel seed layer formation and its impact on Ni-Cu contact adhesion for c-Si solar cell applications. Sol Energy 155:62–74. https://doi.org/10.1016/j.solener.2017.06.002
4. Banerjee A, Halder N (2010) Electrochemical growth of ordered nickel nano-rods within a composite structure of anodic-alumina-membrane/metal/silicon substrate. J Nanosci Nanotechnol 10(7):4252–4258. https://doi.org/10.1166/jnn.2010.2675
5. Basaev AS, Shulitskii BG, Vorob'eva AI, Prudnikova EL, Labunov VA, Mozalev AM, Shaman YP, Kukin VN (2011) Nanocomposite carbon material with ordered structure synthesized using porous aluminum oxide. Nanotechnol Russia 6(3–4): Article No.171. https://doi.org/10.1134/S1995078011020029
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