Effects of Addition of Resin Particles to Ceria-Based Slurry on Pre-Metal Dielectric Planarization-Reference-Cited by-同舟云学术

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Effects of Addition of Resin Particles to Ceria-Based Slurry on Pre-Metal Dielectric Planarization

Published:2010 Issue:5 Volume:157 Page:H510
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Matsui Yukiteru,Eda Hajime,Seta Satoko,Ono Takatoshi,Tateyama Yoshikuni,Nishioka Takeshi,Yano Hiroyuki,Masuko Masabumi

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Effects of Pattern Density and Pitch on Interaction Distance and Shallow Trench Isolation Chemical Mechanical Polishing

2. Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts

3. Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing

4. Assessment of Planarization length variation by the Step-Polish-Response (SPR) Method

5. H. Nojo, M. Kodera, and R. Nakata , inProceedings of the IEEE International Electron Device Meeting, IEEE, p. 343 (1996).

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