Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing-Reference-Cited by-同舟云学术

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Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing

Published:1998 Issue:1 Volume:11 Page:129-140
ISSN:0894-6507
Container-title:IEEE Transactions on Semiconductor Manufacturing
language:
Short-container-title:IEEE Trans. Semicond. Manufact.

Author:

Stine B.E.,Ouma D.O.,Divecha R.R.,Boning D.S.,Chung J.E.,Hetherington D.L.,Harwoo C.R.,Nakagawa O.S.,Soo-Young Oh

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx4/66/14395/00661292.pdf?arnumber=661292

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