(Invited) Challenges on Surface Conditioning in 3D Device Architectures: Triple-Gate FinFETs, Gate-All-Around Lateral and Vertical Nanowire FETs-Reference-Cited by-同舟云学术

(Invited) Challenges on Surface Conditioning in 3D Device Architectures: Triple-Gate FinFETs, Gate-All-Around Lateral and Vertical Nanowire FETs

Published:2017-08-15 Issue:2 Volume:80 Page:3-20
ISSN:1938-6737
Container-title:ECS Transactions
language:en
Short-container-title:ECS Trans.

Author:

Veloso Anabela,Paraschiv Vasile,Vecchio Emma,Devriendt Katia,Li Waikin,Simoen Eddy,Chan B. T.,Tao Zheng,Rosseel Erik,Loo Roger,Milenin Alexey P.,Kunert Bernardette,Teugels Lieve,Sebaai Farid,Lorant Christophe,van Dorp Dennis,Altamirano-Sánchez Efraín,Brus Stephan,Marien Philippe,Fleischmann Claudia,Melkonyan Davit,Huynh-Bao Trong,Eneman Geert,Hellings Geert,Sibaja-Hernandez Arturo,Matagne Philippe,Waldron Niamh,Mocuta Dan,Collaert Nadine

Publisher

The Electrochemical Society

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