Role of Guanidine Carbonate and Crystal Orientation on Chemical Mechanical Polishing of Ruthenium Films
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference60 articles.
1. Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms
2. Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers
3. Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating
4. Electrodeposition of Copper Thin Film on Ruthenium
5. Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing
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