Abrasive-free chemical-mechanical planarization (CMP) of gold for thin film nano-patterning-Reference-Cited by-同舟云学术

Abrasive-free chemical-mechanical planarization (CMP) of gold for thin film nano-patterning

Published:2024 Issue: Volume: Page:
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Gherman Raphael¹²^ORCID,Beaudin Guillaume¹²^ORCID,Stricher Romain¹²,Bryche Jean-François¹²^ORCID,Levesque Pierre³^ORCID,Fillion-Gourdeau François³⁴^ORCID,MacLean Steve G.³⁴⁵,Drouin Dominique¹²^ORCID,Charette Paul G.¹²^ORCID,Ecoffey Serge¹²^ORCID

Affiliation:

1. Institut Interdisciplinaire d′Innovation Technologique (3IT), Université de Sherbrooke, 3000 Boulevard de l'université, Sherbrooke, J1K 0A5 Québec, Canada

2. Laboratoire Nanotechnologies Nanosystèmes (LN2)-IRL3463, CNRS, Université de Sherbrooke, Sherbrooke, J1K 0A5 Québec, Canada

3. Institute for Quantum Computing, University of Waterloo, Waterloo, Ontario, Canada, N2L 3G1

4. Infinite Potential Laboratories, Waterloo, Ontario, Canada, N2L 0A9

5. Université du Québec, INRS-Énergie, Matériaux et Télécommunications, Varennes, Québec, Canada J3X 1S2

Abstract

This 5 × 3 mm2 photograph shows the vibrant colors reflected by a nanostructured gold surface made by CMP. Each 20 × 20 μm2 pixel is a mosaic of gold nanocubes with different dimensions, creating this colorful image of the gold CMP damascene technique.

Funder

Natural Sciences and Engineering Research Council of Canada

CMC Microsystems

Université de Sherbrooke

Publisher

Royal Society of Chemistry (RSC)

Link

http://pubs.rsc.org/en/content/articlepdf/2024/NR/D4NR02610A

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