3D interconnects for III-V semiconductor heterostructures for miniaturized power devices
Author:
Publisher
Elsevier BV
Subject
General Physics and Astronomy,General Energy,General Engineering,General Materials Science,General Chemistry
Reference57 articles.
1. Inkjet printing technology for increasing the I/O density of 3D TSV interposers;Khorramdel;Microsyst. Nanoeng.,2017
2. A review on the fabrication and reliability of three-dimensional integration technologies for microelectronic packaging: Through-Si-via and solder bumping process;Cho;Metals,2021
3. TSV manufacturing yield and hidden costs for 3D IC integration;Lau,2010
4. Reliability challenges related to TSV integration and 3-D stacking;Croes;IEEE Des. Test,2016
5. A detailed failure analysis examination of the effect of thermal cycling on Cu TSV reliability;Okoro;IEEE Trans. Electron Devices,2014
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