Practical Monitoring of Filling Performance in a Copper Plating Bath-Reference-Cited by-同舟云学术

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Practical Monitoring of Filling Performance in a Copper Plating Bath

Published:2006 Issue:8 Volume:9 Page:C134
ISSN:1099-0062
Container-title:Electrochemical and Solid-State Letters
language:en
Short-container-title:Electrochem. Solid-State Lett.

Author:

Dow Wei-Ping,Yen Ming-Yao,Chou Cheng-Wei,Liu Cheng-Wei,Yang Wei-Hsiu,Chen Chih-Hui

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Reference25 articles.

1. Development of sequential build-up multilayer printed wiring boards in Japan

2. Next-Generation Microvia and Global Wiring Technologies for SOP

3. Damascene copper electroplating for chip interconnections

4. Superconformal film growth: Mechanism and quantification

5. Interactions Between Brightener and Chloride Ions on Copper Electroplating for Laser-Drilled Via-Hole Filling

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2. Towards void-free copper filling of low-aspect-ratio heat dissipation through holes in packaging substrate with high H2SO4 concentration electroplating system;Journal of Industrial and Engineering Chemistry;2024-07

3. Cu microvia filling by pulse-reverse electrodeposition with a single accelerator;Electrochimica Acta;2024-06

4. Alkyl-terminated PEG suppressors for copper electroplating and their hydrophilic and hydrophobic properties;Surface and Coatings Technology;2024-05

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