Cu microvia filling by pulse-reverse electrodeposition with a single accelerator-Reference-Cited by-同舟云学术

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Cu microvia filling by pulse-reverse electrodeposition with a single accelerator

Published:2024-06 Issue: Volume:490 Page:144279
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Seo Huiju,Kim Jounghee,Kang Jungkyu,Park Jong-Eun,Kim Myung Jun^ORCID,Kim Jae Jeong^ORCID

Funder

Samsung Group

Publisher

Elsevier BV

Reference44 articles.

1. The role of SPS, MPSA, and chloride in additive systems for copper electrodeposition;Tan;J. Electrochem. Soc.,2006

2. Curvature enhanced adsorbate coverage model for electrodeposition;Moffat;J. Electrochem. Soc.,2006

3. Superconformal Cu electrodeposition using DPS: a substitutive accelerator for bis(3-sulfopropyl) disulfide;Cho;J. Electrochem. Soc.,2005

4. PEG, PPG and their triblock copolymers as suppressors in copper electroplating;Gallaway;J. Electrochem. Soc.,2008

5. Copper electroplating with polyethylene glycol;Yang;J. Electrochem. Soc.,2017

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