Material Removal Rate of 4H-SiC Polishing with Polystyrene/CeO2 Core/shell Abrasives
Author:
Funder
National Natural Science Foundation of China
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1149/2162-8777/abba03/pdf
Reference55 articles.
1. GaAs, AlAs, and AlxGa1−xAs: Material parameters for use in research and device applications
2. Optimum semiconductors for high-power electronics
3. Present Status and Future Prospect of Widegap Semiconductor High-Power Devices
4. Competition between surface modification and abrasive polishing: a method of controlling the surface atomic structure of 4H-SiC (0001)
5. Optimization of the plasma oxidation and abrasive polishing processes in plasma-assisted polishing for highly effective planarization of 4H-SiC
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Defect-Engineered MnO2 as Catalyst for the Chemical Mechanical Polishing of Silicon Carbide Wafer;ECS Journal of Solid State Science and Technology;2023-07-01
2. Development of polystyrene/polyaniline/ceria (PS/PANI/CeO2) multi-component abrasives for photochemical mechanical polishing/planarization applications;Applied Surface Science;2022-02
3. Novel photoelectrochemically combined mechanical polishing technology for scratch-free 4H-SiC surface by using CeO2-TiO2 composite photocatalysts and PS/CeO2 core/shell abrasives;Applied Surface Science;2021-12
4. Communication—A Strategy to Reduce the Content of Residual Oxide Layer on SiC Surface in ECMP;ECS Journal of Solid State Science and Technology;2021-04-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3