Investigations of the Pad Trajectory Effect on the Asymmetric Profile and Arc-Shaped Scratches in Chemical Mechanical Polishing

Author:

Hwang Kyungho,Seo Kwoonhwi,Kwon Yoonjung,Lim Jimin,Moon Hyunil,Jang Inbae,Park Kihong,Liu Pengzhan,Kim TaesungORCID

Funder

Ministry of Trade, Industry & Energy

National Research Foundation of Korea

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

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1. Investigation of Polisher Head and Slurry Sweep Effect in Oxide Film Polishing;ECS Journal of Solid State Science and Technology;2024-04-01

2. Environmentally friendly buff cleaning of ceria nanoparticles using bubbles in gas-dissolved water;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2023-08

3. The mechanical effect of soft pad on copper chemical mechanical polishing;Materials Science in Semiconductor Processing;2023-03

4. INVESTIGATION OF THERMAL MANAGEMENT DURING CHEMICAL MECHANICAL POLISHING PROCESS;Proceeding of International Heat Transfer Conference 17;2023

5. Investigation of abrasive behavior between pad asperity and oxide thin film in chemical mechanical planarization;Materials Science in Semiconductor Processing;2022-02

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