Effects of H2O2 and pH on the Chemical Mechanical Planarization of Molybdenum
Author:
Funder
Korea Institute for Advancement of Technology
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1149/2162-8777/ac26d3/pdf
Reference33 articles.
1. Technology and reliability constrained future copper interconnects. I. Resistance modeling;Kapur;IEEE Trans. Electron Devices,2002
2. Alternative metals for advanced interconnects;Adelmann,2014
3. Mechanism of Cobalt bottom-up filling for advanced node interconnect metallization;Wu;J. Electrochem. Soc.,2018
4. Ruthenium metallization for advanced interconnects;Wen,2016
5. Electron mean free path in elemental metals
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