(Invited) Current and Future Applications of ALD in Micro-Electronics

Abstract

This paper describes the status of current and future applications of Atomic Layer Deposition (ALD) and Plasma Enhanced ALD (PEALD) in the field of Micro-electronics. Substantial expansion of the ALD market is expected in the coming decade, both in IC manufacturing, but also in adjacent non-IC applications. Several techniques will be described that work around the relatively slow deposition rate of ALD.