High wet-etch resistance SiO<sub>2</sub> films deposited by plasma-enhanced atomic layer deposition with 1,1,1-tris(dimethylamino)disilane-Reference-Cited by-同舟云学术

High wet-etch resistance SiO₂ films deposited by plasma-enhanced atomic layer deposition with 1,1,1-tris(dimethylamino)disilane

Published:2022-03 Issue:2 Volume:40 Page:022406
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A
language:en
Short-container-title:Journal of Vacuum Science & Technology A

Author:

Hwang Su Min¹^ORCID,Kim Harrison Sejoon¹^ORCID,Le Dan N.¹^ORCID,Sahota Akshay²^ORCID,Lee Jaebeom¹^ORCID,Jung Yong Chan¹^ORCID,Kim Sang Woo³,Kim Si Joon⁴⁵^ORCID,Choi Rino³^ORCID,Ahn Jinho⁶,Hwang Byung Keun⁷,Zhou Xiaobing⁷^ORCID,Kim Jiyoung¹²^ORCID

Affiliation:

1. Department of Materials Science and Engineering, The University of Texas at Dallas, 800 West Campbell Road, Richardson, Texas 75080

2. Department of Electrical Engineering, The University of Texas at Dallas, 800 West Campbell Road, Richardson, Texas 75080

3. Department of Materials Science and Engineering, Inha University, 100 Inha-ro Michuhol-gu, Incheon 22212, Republic of Korea

4. Department of Electrical and Electronics Engineering, Kangwon National University, 1 Gangwondaehakgil, Chuncheon, Gangwon-do 24341, Republic of Korea

5. Department of BIT Medical Convergence Kangwon National University, 1 Gangwondaehakgil, Chuncheon, Gangwon-do 24341, Republic of Korea

6. Division of Materials Science and Engineering, Hanyang University, 222 Wangshimni-Ro, Seongdong-Gu, Seoul 04763, Republic of Korea

7. DuPont, 3700 James Savage Rd., 1382 Building, Midland, Michigan 48640

Funder

DuPont

National Research Foundation of Korea

Korea Institute for Advancement of Technology

Ministry of Trade, Industry and Energy

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics