Effects of Large Particles on MRR, WIWNU and Surface Quality in TEOS Chemical Mechanical Polishing Based on FA/O Alkaline Slurry
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference36 articles.
1. Moon Y. , Advances in Chemical Mechanical Planarization, 3 (2016).
2. Material removal mechanism in chemical mechanical polishing: theory and modeling
3. Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: Effects of sorbate on chemical mechanical planarization performance
4. Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Optimization of surface filtration to enhance wafer uniformity by removing large particle in ceria slurry;Materials Science in Semiconductor Processing;2024-11
2. Analysis of cavitation and shear in bellows pump: transient CFD modelling and high-speed visualization;Engineering Applications of Computational Fluid Mechanics;2023-08-19
3. Synergistic effect of aminosilane and K2CO3 on improving Chemical Mechanical Polishing performance of SiO2 dielectric layer;Materials Science in Semiconductor Processing;2022-08
4. Optimizing of the Colloidal Dispersity of Silica Nanoparticle Slurries for Chemical Mechanical Polishing;Silicon;2021-11-02
5. Correlation Among Particle Size Distribution, Subsurface Damages Distribution and Surface Roughness in Optical Polishing Process;ECS Journal of Solid State Science and Technology;2021-08-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3