Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: Effects of sorbate on chemical mechanical planarization performance-Reference-Cited by-同舟云学术

Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: Effects of sorbate on chemical mechanical planarization performance

Published:2010-03 Issue:8 Volume:55 Page:2810-2816
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Nagar Magi,Vaes Jan,Ein-Eli Yair

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference27 articles.

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2. Chemical mechanical planarization for microelectronics applications

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4. Effects of length scaling on electromigration in dual-damascene copper interconnects

5. Effect of current direction on the lifetime of different levels of Cu dual-damascene metallization

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