Nanoscale tribological aspects of chemical mechanical polishing: A review

Author:

Datta Debottam,Rai Himanshu,Singh Swarnima,Srivastava Meenakshi,Sharma Rajesh Kumar,Gosvami Nitya Nand

Funder

Science and Engineering Research Board

DRDO

Indian Institute of Technology Delhi

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces

Reference223 articles.

1. Tribology in Chemical Mechanical Planarization;Hong Liang,2005

2. Multiscale modeling of chemical mechanical planarization (CMP);Fan,2016

3. 18 - Chemical-mechanical polishing (CMP): a controlled tribocorrosion process;Kulkarni,2011

4. M.M. Samad Nadimi Bavil Oliaei, and A. Perveen, Technological Advances and Challenges in Chemical MechanicalPolishing, in: B Das. S, Kibria. G, Doloi. B (Ed.), Springer Nature, Cham, 2020. 10.1007/978-3-030-43312-3.

5. Atomistic mechanisms of Si chemical mechanical polishing in aqueous H2O2: ReaxFF reactive molecular dynamics simulations;Wen;Comput. Mater. Sci.,2017

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