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Chemical and physical mechanisms of dielectric chemical mechanical polishing (CMP)

  • Published:2016 Issue: Volume: Page:3-26
  • ISSN:
  • Container-title:Advances in Chemical Mechanical Planarization (CMP)
  • language:
  • Short-container-title:

Author:

Moon Y.

Publisher

Elsevier

Reference14 articles.

1. Flex-mount polishing of silicon wafers;Bonora;Solid State Technol.,1977

2. Silicon Processing for the VLSI Era;Wolf,1986

3. CMP: suppliers integrating, applications spreading;Burggraaf;Semicond. Int.,1995

4. A new planarization technique, using a combination of RIE and chemical mechanical polish (CMP);Davari,1989

5. Technical challenges in chemical mechanical polishing (CMP) for sub-10nm logic technology;Moon,2015

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1. Adaptive polishing path optimization for free-form uniform polishing based on footprint evolution;The International Journal of Advanced Manufacturing Technology;2024-01-16

2. Recent Developments in Chemical Mechanical Polishing (CMP) for Precision Manufacturing;International Journal of Advanced Research in Science, Communication and Technology;2022-02-27

3. A new metal-organic hybrid material: Synthesis, structural, electro-optical properties and quantum chemical investigation;Optical Materials;2021-11

4. Analysis on Pad Surface Roughness of Diamond Conditioning Process for CMP;ECS Journal of Solid State Science and Technology;2021-04-01

5. A systematic study in synthesis of CeO2 films on Ni tapes from different precursors using sol-gel process;Journal of the Australian Ceramic Society;2020-07-02
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