Pulse Electroplating of Sn-Bi Alloys on Micropatterned Electrodes for Lead-Free Solder Bumping-Reference-Cited by-同舟云学术

Pulse Electroplating of Sn-Bi Alloys on Micropatterned Electrodes for Lead-Free Solder Bumping

Published:2011 Issue:2 Volume:159 Page:D108-D113
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Tsai Yi-Da,Yu Chi-Yang,Hu Chi-Chang,Duh Jenq-Gong

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference42 articles.

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3. Composition Control of Sn–Bi Deposits: Interactive Effects of Citric Acid, Ethylenediaminetetraacetic Acid, and Poly(ethylene glycol)

4. A novel bumping process for fine pitch Sn–Cu lead-free plating-based flip chip solder bumps

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