A novel bumping process for fine pitch Sn–Cu lead-free plating-based flip chip solder bumps-Reference-Cited by-同舟云学术

A novel bumping process for fine pitch Sn–Cu lead-free plating-based flip chip solder bumps

Published:2007-08 Issue:4-5 Volume:10 Page:133-142
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Huang Jung-Tang,Chao Pen-Shan,Hsu Hou-Jun,Shih Sheng-Hsiung

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference29 articles.

1. Gheorghe Pascariu, Peter Cronin, Daniel Crowley, Next generation electronics packaging utilizing flip chip technology. In: IEEE/CPMT/SEMI international electronics manufacturing technology symposium, 2003. p. 423.

2. Electromigration in flip chip solder bump of 97Pb–3Sn/37Pb–63Sn combination structure;Nah;Elsevier, J Acta Mater,2003

3. CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps interfacial reaction and bump shear strengthen;Jang;IEEE Trans Components Packag Technol,2003

4. Formation of Pb/63Sn solder bumps using a solder droplet jetting method;Son;IEEE Trans Packag Manuf,2005

5. Ultra-fine pitch eutectic solder bumping with fine particle size paste for nano packaging;Kripesh;IEEE Electron Packag Technol Conf,2003

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