CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strength
Author:
Affiliation:
1. Mechatronics Center, Samsung Electron. Co. Ltd., Suwon, South Korea
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx5/6144/27079/01202926.pdf?arnumber=1202926
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