Aligned wafer bonding: A key to three dimensional microstructures-Reference-Cited by-同舟云学术

Aligned wafer bonding: A key to three dimensional microstructures

Published:1991-05 Issue:5 Volume:20 Page:383-387
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:JEM

Author:

Bower R. W.,Ismail M. S.,Farrens S. N.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/BF02670888.pdf

Reference19 articles.

1. J. B. Lasky, Appl. Phys. Lett.48, 78 (1986).

2. K. Peterson, P. Barth, J. Plydock, J. Brown, J. Mallon Jr. and J. Bryzek, “Silicon Fusion Bonding for Pressure Sensors,≓ Solid-State Sensor and Actuator Workshop Technical Digest, Hilton Head Island, South Carolina, June (1988).

3. P. Barth, F. Pourahmadi, R. Mayer, J. Plydock and K. Peterson,≓ A Monolithic Accelerometer with Integral Air Damping and Overange Protection,≓ Solid State Sensor and Actuator Workshop Technical Digest, Hilton Head Island, South Carolina, June (1988).

4. K. E. Peterson, IEEE Trans. Electron Devices,ED-26, 1918 (1979).

5. L. Tenerz and B. Hok, Electron. Lett.22, 615 (1986).

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