Effect of Chelating Agent and Surfactant on TaN CMP in Weakly Alkaline Slurry
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference27 articles.
1. Thin film deposition of Ta, TaN and Ta/TaN bi-layer on Ti and SS316-LVM substrates by RF sputtering
2. Seed layer enhancement by electrochemical deposition: The copper seed solution for beyond 45nm
3. Comparative study of Ta, TaN and Ta/TaN bi-layer barriers for Cu-ultra low-k porous polymer integration
4. Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry
5. Mechanical and corrosive characteristics of Ta/TaN multilayer coatings
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