Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry
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Published:2010-07-01
Issue:7
Volume:10
Page:4196-4203
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ISSN:1533-4880
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Container-title:Journal of Nanoscience and Nanotechnology
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language:en
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Short-container-title:J. Nanosci. Nanotech.
Author:
Lee Wen-Hsi,Hung Chi-Cheng,Wang Yu-Sheng,Chang Shih-Chieh,Wang Ying-Lang
Publisher
American Scientific Publishers
Subject
Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering
Cited by
1 articles.
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