1. Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms
2. Hecker M. Hübner R. , in Advanced Interconnects for ULSI Technology, Baklanov M. Ho P. S. Zschech E. , Editors, Ch. 6, John Wiley, West Sussex (2012).
3. Highly reliable copper dual-damascene interconnects with self-formed MnSi/sub x/O/sub y/ barrier Layer
4. Characterization of Chemically Vapor Deposited Manganese Barrier Layers Using X-ray Absorption Fine Structure
5. Gordon R. G. Kim H. Au Y. Wang H. Bhandari H. B. Liu Y. Lee D. K. Lin Y. , in Proc. Advanced Metallization Conference 2008, San Diego, California, and Tokyo, Japan, Vol. 24, Naik M. Shaviv R. Yoda T. Ueno K. , Editors, Materials Research Society, Warrendale (2009).